Die-Demounter

Die-Demounter
Die Demounter-A Die Demounter-B
The Die-Demounters can easily remove fully sawn wafers from a film frame in less than thirty seconds. We offers a full line of Die-Demounters that can handle wafers as large as 300 mm (Model 3010) and die sizes down to 25 mm square (Model 1O1OSD and 2O1OSD).During operation, the operator places each wafer on a transport. A breaker bar separates the leading edge of the film and feeds it into a film separator. The die while maintaining their original orientation are separated from the tape and spread loosely on a removable tray. The tray can then be taken to another station for manual die sorting. Several of these trays can be used simultaneously to allow a number of operators to sort die.There are no machine adjustments required when changing wafer or die size. The full line of Die-Demounters are versatile, easy-to-use and require little operator training.Features• 6″ ~ 8″and 12″ wafer capability, dependent on model type
• Semi-automatic operation insures no yield loss
• One setup runs all die sizes
• Versatile, easy-to-use
• Safe handling of die
• No mechanical adjustments

Specifications

• Die Material:

Si, GaAs, and other sawn material

• Wafer Tape:

≤0.07 mm thickness (0.003 in.)

• Electrical:

120 VAC, 50/60 Hz, 2.0 Amps

• Air:

30 psi CDA (50 psi for 3010)

• Dimensions:

34” x 19” xli” (high)

(86 x 48 x 28 cm)

56” x 27” x 11” (high) for 3010

• Weight:

60 lbs (27 Kg)

(100 lbs (45 Kg) for Model 3010)
Model
Max. Wafer
Size
Min. Die Size
(mm)
Min. Die Thickness
(mm)
Max. Film Frame
Inner Dia. (mm)
1010D
200 (8 in.)
1.78 (0.070 in.)
0.38 (0.015 in.)
245(9.64 in.)
1010SD
200 (8 in.)
0.25 (0.010 in.)
0.10 (0.004 in.)
245 (9.64 in.)
2010
150 (6 in.)
0.50 (0.020 in.)
0.10 (0.004 in.)
194 (7.64 in.)
2010SD
150 (6 in.)
0.25 (0.010 in.)
0.10 (0.004 in.)
194 (7.64 in.)
3010
300 (12 in.)
0.76 (0.030 in.)
0.25 (0.010 in.)
350 (13.8 in.)